Three Common Shielding Metals

It is essential for electronics engineers to carefully consider balancing cost and performance when it comes to constructing EMI and RFI shielding. Tipping the scale too far one way has negative consequences. Being aware of the design process allows for individuals to make critical decisions that help guide the decision-making process.

EMI Shielding

People need to be mindful of:

  • Costs (tooling costs/part price)
  • Conductivity
  • Application environment
  • Galvanic compatibility
  • Application frequencies
  • Material thickness
  • Enclosure geometry
  • Long vs. short term production quantities

Each of the above factors affects cost, packaging, assembly, and time of construction.

Of all the fundamental and crucial decisions an engineer can make, material selection is amongst the most important. The materials used for RFI and EMI shielding have a direct effect on the application performance and the cost of the project. We offer a comprehensive selection of materials to meet the strict demands of our customers.

EMI Shielding

There are several popular metals that are used to create RFI Shielding and EMI Shielding. These popular metals include:

Pre-tin plated steel: this metal is ideal for low-cost constructions that operate in low frequencies in the kHz range. They also work well for low frequencies in the GHz range. Tin plating offers extra corrosion resistance that prevents rusting.
Copper alloy 770: this alloy is commonly referred to simply as alloy 770. It is frequently used because of its strong corrosion resistance properties. Engineers like this material for work in the mid kHz range and mid GHz range.
Aluminum: the metal presents several fabrication challenges, but it is still an excellent application that requires non-ferrous properties. It has a high strength to weight ratio, and it is highly conductive.

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